Скачать с ютуб Non-plasma Bonding of PDMS for Inexpensive Fabrication of Microfluidic Devices в хорошем качестве

Non-plasma Bonding of PDMS for Inexpensive Fabrication of Microfluidic Devices

This alternative method involves using a chemical bonding agent to create a strong and durable bond between PDMS layers. By applying the bonding agent to the surfaces to be bonded and then curing them together, a reliable and long-lasting bond can be achieved without the need for expensive plasma equipment. This method not only reduces the cost of fabrication but also simplifies the process, making it more accessible to researchers and manufacturers. Additionally, this alternative bonding method has been shown to maintain the biocompatibility and flexibility of PDMS, making it suitable for a wide range of microfluidic applications. The chemical bonding agent used in this method is typically a silane-based adhesive, which forms strong covalent bonds with the PDMS surface. This adhesive is applied to the surfaces to be bonded and allowed to cure, creating a permanent bond that is resistant to delamination and leakage. The bonding process can be done at room temperature, eliminating the need for specialized equipment or high temperatures. This alternative bonding method has been successfully used in various microfluidic applications, such as lab-on-a-chip devices, microfluidic pumps, and organ-on-a-chip systems. The strong and durable bond created by the chemical bonding agent ensures that the devices can withstand the rigors of continuous use and maintain their functionality over time.