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Bob Willis Solder Paste Print, Reflow Problems Causes and Cures Webinar

Solder Paste Inspection, Quality Control, Common Print and Reflow Problems - Causes & Cures Webinar If you missed the SMTA International pre show webinar you can view it online NOW!!!! Printing solder paste or other conductive material requires zero defects printing if a high first pass yield is to be achieved when using fine pitch components. Monitoring and control of paste height and volume are becoming the norm in many markets, but what capability can we expect? Correct printer set-up, good stencil design and manufacture plus consistent printing materials are key to successful manufacture but inspection and monitoring the performance makes a process more robust. The same three dimensional inspections is required in other AOI applications like solder joint analysis. there are common process defects during printing and reflow and with this webinar we show you the causes and cures to help your yield improvement Webinar presented by Bob Willis SMTA Process Feature Organiser Topics covered in the webinar: Solder paste inspection standards Soldering yield impact with poor printing Common solder paste defects Impact on reliability based on paste thickness Solder joint inspection defects Common process defects causes and cures Visit us at SMTA International http://www.smta.org/smtai/sMTAIExperi...