Русские видео

Сейчас в тренде

Иностранные видео


Скачать с ютуб Packaging Part 1 - Traditional Packaging - Alonso Lopez в хорошем качестве

Packaging Part 1 - Traditional Packaging - Alonso Lopez 4 года назад


Если кнопки скачивания не загрузились НАЖМИТЕ ЗДЕСЬ или обновите страницу
Если возникают проблемы со скачиванием, пожалуйста напишите в поддержку по адресу внизу страницы.
Спасибо за использование сервиса savevideohd.ru



Packaging Part 1 - Traditional Packaging - Alonso Lopez

References: [1] Higgins, S. (2018, January 18). TSMC expects 'strong' crypto mining demand to continue. Retrieved from https://www.coindesk.com/tsmc-expects... [2] US LIMITS TECH EXPORTS TO CHINESE FIRM ON SECURITY GROUNDS. (2018, November 2). Retrieved from https://www.scribd.com/article/392251... [3] Jeff. (2010, October 25). Mosis. Retrieved from https://mightyohm.com/blog/tag/mosis/ [4] Campbell, M. (2021, January 22). "The majority of our 2023 products will be manufactured internally" - Intel's new CEO is pleased With 7nm's progress. Retrieved from https://overclock3d.net/news/cpu_main... [5] Sutton, M. (n.d.). Intel launches new high end gaming processor. Retrieved from https://www.itp.net/channel/85993/618... [6] Optical sensors / image sensors. (n.d.). Retrieved from https://amkor.com/technology/optical-... [7] Qualcomm Snapdragon 800 Processor first to Use Tsmcs 28HPM advanced process technology. (2013). Microelectronics International, 30(3). doi:10.1108/mi.2013.21830caa.009 [8] Geen, M., Harman, S., & Zhang, J. (2018, December 03). Teledyne E2V completes FIRST Multi-Chip Module assembly on Organic flip-chip. Retrieved from https://www.microwavejournal.com/arti... [9] Aril Sigvartsen, J. (2008, April 10). Unix/Linux-server på 5 GHz. Retrieved from https://www.tek.no/nyheter/nyhet/i/4q... [10] OSD3358-512M-BSM. (n.d.). Retrieved from https://www.digikey.com/en/products/d... [11] W. Chen, P. Rao and W. Tung, "LTCC WiGig Radio Module & USB Dongle," 2019 IEEE International Symposium on Phased Array System & Technology (PAST), Waltham, MA, USA, 2019, pp. 1-3, doi: 10.1109/PAST43306.2019.9021082. [12] J. Minz, E. Wong, and S. K. Lim, “Thermal and crosstalk-aware physical design for 3D system-on-package,” Proc. - Electron. Components Technol. Conf., vol. 1, no. January 2005, pp. 824–831, 2005, doi: 10.1109/ectc.2005.1441368.

Comments