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A lamella of a 3D NAND was accurately thinned on a FIB-SEM with the assistance of STEM and Single Tilt Holder. While cross-sectional SEM image of the lamella in the middle of thinning shows only the wirings exposed on the surface, STEM image reveals the buried wirings of depth. The lamella was thinned until the buried wirings were gone while observing the STEM image. Finally, the lamella was oriented vertically to the SEM optics to obtain high quality STEM image. #3DNAND #NAND #lamella #FIB #SEM #STEM #FIBSEM #electronmicroscopy #ElectronMicroscope Available instruments for this measurement are : FIB-SEM https://www.hitachi-hightech.com/glob... Further details can be found on our membership website with data library. Looking forward to your joining. https://biz.hitachi-hightech.com/sina... About our membership site, see https://www.hitachi-hightech.com/glob...