Скачать с ютуб Technology Trends & Challenges in Power Semiconductor Packaging в хорошем качестве

Technology Trends & Challenges in Power Semiconductor Packaging

The power semiconductors market is at least seven decades-old with products supporting numerous applications in consumer, industrial and automotive segments. Over time, these packages have evolved from traditional through-hole and gull-wing type packages to surface-mount packages and low-profile leadless alternatives. With the current macro-level trend in automotive electrification and the emerging 48V ecosystem in 5G data centers, there is a growing need for highly efficient, space-saving and reliable packaging solutions to support higher switching frequencies and greater power densities. While silicon-based power devices continue to play a critical role, the emergence of devices based on wide-bandgap materials, such as gallium nitride (GaN) and silicon carbide (SiC), will play a much greater role in the next decade for high-power applications. These advanced materials drive the need to innovate further in the packaging area to meet the demands for effective thermal management while maintaining cost competitiveness and high-reliability standards. This presentation will discuss the current power packaging technology trends and challenges associated with developing the next generation packages to support the evolving power market needs and showcase how innovative packaging can address some of these challenges. Presented by Gopi Boinepally, Sr. Director - Power Products at Amkor Technology Presented at ISES Webinar